Saini, S., Shah, J. M., Shahi, P., Bansode, P., Agonafer, D., Singh, P., Schmidt, R., and Kaler, M. (September 15, 2021). “Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review.” ASME. J. Electron. Packag. September 2022; 144(3): 030801. https://doi.org/10.1115/1.4051255
Shahi, P., Deshmukh, A., Hurnekar, H., Saini, S., Bansode, P. V., Kasukurthy, R., and Agonafer, D. (September 2, 2021). “Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers.” ASME. J. Electron. Packag. doi: https://doi.org/10.1115/1.4052324
Shah, J. M., Padmanaban, K., Singh, H., Duraisamy Asokan, S., Saini, S., and Agonafer, D. (September 24, 2021). “Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling.” ASME. J. Electron. Packag. doi: https://doi.org/10.1115/1.4052536
S. Singh, K. Nemati, V. Simon, A. Siddarth, M. Seymour, and D. Agonafer, “Sensitivity Analysis of a Calibrated Data Center Model to Minimize the Site Survey Effort BT – 37th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2021, March 22, 2021 – March 26, 2021,” 2021, pp. 50–57.
P. Shahi, S. Saini, P. Bansode, and D. Agonafer, “A Comparative Study of Energy Savings in a Liquid-Cooled Server by Dynamic Control of Coolant Flow Rate at Server Level,” IEEE Trans. Components, Packag. Manuf. Technol., vol. 11, no. 4, pp. 616–624, 2021, doi: 10.1109/TCPMT.2021.3067045.
R. Kasukurthy, A. Rachakonda, and D. Agonafer, “Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling,” J. Electron. Packag. Trans. ASME, vol. 143, no. 3, Sep. 2021, doi: 10.1115/1.4049018.
A. Misrak et al., “Impact of die attach sample preparation on its measured mechanical properties for MEMS sensor applications,” J. Microelectron. Electron. Packag., vol. 18, no. 1, pp. 21–28, 2021, doi: 10.4071/imaps.1234982.
A. S. M. R. Chowdhury et al., “A comparative study of thermal aging effect on the properties of siliconebased and siliconefree thermal gap filler materials,” Materials (Basel)., vol. 14, no. 13, 2021, doi: 10.3390/ma14133565.
S. Saini, K. K. Adsul, P. Shahi, A. Niazmand, P. Bansode, and D. Agonafer, “CFD Modeling of the distribution of airborne particulate contaminants inside data center hardware BT – ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, October 27, 2020 – October 29, 2020,” 2020, p. Electronic and Photonic Packaging Division, doi: 10.1115/IPACK2020-2590.
S. Saini, P. Shahi, P. Bansode, A. Siddarth, and D. Agonafer, “CFD Investigation of Dispersion of Airborne Particulate Contaminants in a Raised Floor Data Center BT – 36th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2020, March 16, 2020 – March 20, 2020,” 2020, pp. 39–47, doi: 10.23919/SEMI-THERM50369.2020.9142865.
A. Lakshminarayana, A. Misrak, R. Bhandari, T. Chauhan, A. S. M. Raufur Chowdhury, and D. Agonafer, “Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages under Drop Test BT – 70th IEEE Electronic Components and Technology Conference, ECTC 2020, June 3, 2020 – June 30, 2020,” 2020, vol. 2020-June, pp. 2266–2271, doi: 10.1109/ECTC32862.2020.00353.
A. Niazmand, T. Chauhan, S. Saini, P. Shahi, P. V. Bansode, and D. Agonafer, “CFD Simulation of two-phase immersion cooling using fc-72 dielectric fluid BT – ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, October 27, 2020 – October,” 2020, p. Electronic and Photonic Packaging Division, doi: 10.1115/IPACK2020-2595.
V. S. Simon, A. Siddarth, and D. Agonafer, “Artificial Neural Network Based Prediction of Control Strategies for Multiple Air-Cooling Units in a Raised-floor Data Center BT – 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020, July 21, 2020 -,” 2020, vol. 2020-July, pp. 334–340, doi: 10.1109/ITherm45881.2020.9190431.
A. Niazmand, P. Murthy, S. Saini, P. Shahi, P. Bansode, and D. Agonafer, “Numerical analysis of oil immersion cooling of a server using mineral oil and al2o3 nanofluid BT – ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, October 2,” 2020, p. Electronic and Photonic Packaging Division.
P. Shahi, S. Agarwal, S. Saini, A. Niazmand, P. Bansode, and D. Agonafer, “CFD Analysis on liquid cooled cold plate using copper nanoparticles BT – ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, October 27, 2020 – October 29, 20,” 2020, p. Electronic and Photonic Packaging Division, doi: 10.1115/IPACK2020-2592.
A. Misrak, T. Chauhan, P. Rajmane, R. Bhandari, and D. Agonafer, “Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers,” J. Electron. Packag., vol. 142, no. 1, pp. 1–9, 2020, doi: 10.1115/1.4045157.
O. Awe, J. M. Shah, D. Agonafer, P. Singh, N. Kannan, and M. Kaler, “Experimental description of information technology equipment reliability exposed to a data center using airside economizer operating in recommended and allowable ASHRAE envelopes in an ANSI/ISA classified G2 environment,” J. Electron. Packag. Trans. ASME, vol. 142, no. 2, Jun. 2020, doi: 10.1115/1.4046556.
J. M. Shah et al., “Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization,” J. Electron. Packag. Trans. ASME, vol. 142, no. 4, Dec. 2020, doi: 10.1115/1.4047469.
P. V. Bansode et al., “Measurement of the thermal performance of a custom-build single-phase immersion cooled server at various high and low temperatures for prolonged time,” J. Electron. Packag. Trans. ASME, vol. 142, no. 1, Mar. 2020, doi: 10.1115/1.4045156.
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