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Welcome to the EMNSPC Research Center at UTA! Our research focuses on developing and studying conventional and novel Data Center cooling technologies and determining the effects of the environmental conditions on IT equipment reliability at the server as well as package level. We have both computational   and experimental capabilities to provide the best solutions to the fundamental issues related to IT equipment cooling in the Data Center industry.

 

 

Liquid Cooling Plate

Latest Research Papers

  • Shah JM, Misrak A, Agonafer D, Kaler M. Identification and Characterization of Particulate Contaminants found at a data center using Airside Economization.
  • Shah JM, Eiland R, Rajmane P, Siddarth A, Agonafer DD, Mulay V. Reliability Considerations for Oil Immersion Cooled Data Centers. J Electron Packag. 2019 Mar 1 Available from: http://dx.doi.org/10.1115/1.4042979
  • Walekar A, Siddarth A, Guhe A, Sukthankar N, Agonafer D. Neural Network Based Bin Analysis for Indirect/Direct Evaporative Cooling of Modular Data Centers. In: Proceedings of the ASME 2018 International Mechanical Engineering Congress and Exposition. Pittsburgh, PA, USA: ASME; 2018.
  • Varadharasan M, Agonafer D, Khazraji AA, Shah J, Siddarth A, Hoverson J, et al. A thermo-mechanical study on vertically split distribution-wet cooling media used in data centers. In: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, August 27, 2018 – August 30, 2018. American Society of Mechanical Engineers (ASME); 2018. p. Electronic and Photonic Packaging Division. (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018).
  • Thirunavakkarasu G, Saini S, Shah J, Agonafer D. Air flow pattern and path flow simulation of airborne particulate contaminants in a high-density data center utilizing airside economization. In: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, August 27, 2018 – August 30, 2018. American Society of Mechanical Engineers (ASME); 2018. p. Electronic and Photonic Packaging Division. (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018).
  • Sukthankar N, Walekar A, Agonafer D. Supply Air Temperature Prediction in An Air-Handling Unit Using Artificial Neural Network. In: Proceedings of the ASME 2018 International Mechanical Engineering Congress and Exposition. Pittsburgh, PA, USA: ASME; 2018.
  • Siddarth A, Eiland R, Fernandes JE, Agonafer D. Impact of Static Pressure Differential between Supply Air and Return Exhaust on Server Level Performance. In: 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018, May 29, 2018 – June 1, 2018. Institute of Electrical and Electronics Engineers Inc.; 2018. p. 953–61. (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018).
  • Sahini M, McGinn P, Kshirsagar C, Agonafer D. Ack-level study of hybrid cooled servers using warm water cooling with variable pumping for centralized coolant system. In: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, August 27, 2018 – August 30, 2018. American Society of Mechanical Engineers (ASME); 2018. p. Electronic and Photonic Packaging Division. (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018).
  • Sahini M, Agonafer D. Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis. Journal of Microelectronics and Electronic Packaging. 2018;15(1):21–34.
  • Kasukurthy R, Challa PS, Palanikumar RR, Manimaran BR, Agonafer D. Flow Analysis and Linearization of Rectangular Butterfly Valve Flow Control Device for Liquid Cooling. In: 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018, May 29, 2018 –  June 1, 2018. Institute of Electrical and Electronics Engineers Inc.; 2018. p. 683–7. (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018).
  • Dhadve M, Shah JM, Agonafer D. CFD Simulation and Optimization of the Cooling of Open Compute Machine Learning “big Sur” Server. In: 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018, May 29, 2018 –  June 1, 2018. Institute of Electrical and Electronics Engineers Inc.; 2018. p. 962–70. (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018).

Latest News

Agonafer Wins IBM Faculty Award

Dereje Agonafer, a mechanical engineering professor in the Mechanical and Aerospace Engineering Department, has won an IBM Faculty Award. The award, which is accompanied by a $30,000 donation, recognizes Agonafer’s sustained collaborations with IBM and the industry,...

 


 

Location

Box 19018, 500 W. First Street

RM. 211, Woolf Hall

Arlington, Texas 76019-0018

Contact Us

Admin Office Tel: 817- 272-7371

E-Mail: emnspc@uta.edu

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