• Data Center Cooling

  • 3D Packaging

  • Chip Scale Packaging

  • Compact Modeling

  • Computer Aided Electro-Thermo-Mechanical Design

  • Refrigeration Cooling

  • Reliability

  • Thermoelectrics

EMNSPC Mission

The mission of EMNSPC at UTA is to establish a first class research center that will meet the needs of industry, and in particular, the state of Texas and the North Texas region's "Electronic, MEMS and Nanoelectronics Packaging Industry". This includes research, education and training. EMNSPC will target the needs of the Microelectronics, MEMS and Nanoelectronics (with a special emphasis on thermo mechanical issues) as a fundamental research area as these technologies have and will continue to overlap. "Technology" and "Executive" Advisory Board members from Industry will provide leadership and guidance to the Center.

A National Science Foundation Industry/University Cooperative Research Center (I/UCRC), works in partnership with government, industry and to develop systematic methodologies for efficiently operating electronic systems.

                       University of Arlington

Grad Team Meetings
Fridays at 4.00 pm
Visitors Welcome!

Contact Us:

Box 19018, 500 W. First Street

RM. 211, Woolf Hall

Arlington, Texas 76019-0018

Admin Office Tel: 817- 272-7371