Fig. Equivalent stress on corner solder joint.
Fig. Meshed Quarter Model.
Current Projects
Material Characterization of Electronic Packaging Materials
Change of Material Properties due to Environmental Load Conditions
Experimental and computational component and board level reliability assessment
Location
Box 19018, 500 W. First Street
RM. 211, Woolf Hall
Arlington, Texas 76019-0018
Contact Us
Admin Office Tel: 817- 272-7371
E-Mail: emnspc@uta.edu