- ME 5352. FUNDAMENTALS IN ELECTRONIC PACKAGING (3-0)
- An introductory treatment of electronic packaging, from single chip to multichip, including materials, electical design, thermal design, mechanical design, package modeling nd simulation, processing considerations, reliability, and testing.
- Prerequisite: Heat Transfer, Material Science and Fluid Dynamics
- ME 5353. APPLICATION OF COMPUTATIONAL TECHNIQUES TO ELECTRONIC PACKAGING (3-0)
- This course will develop the student’s capability to characterize the heat performance of electronic cooling devices by using Commercial Computational Heat Transfer Codes like IDEAS ESC,Icepack, FLOTHERM, CFDAce. In addition, the use of Macroflow, a network based model, for system-level thermal design for electronics cooling will be presented. A number of industry-related problems ranging from first-level packages would be analyzed. At the end of the class, a student is expected to formulate and model complex industry-based problems using the commercial CFD codes. There will be frwuent industry speakers on specific projects being studied in the class.
- ME 5354 FAILURES AND THEIR PREVENTION IN ELECTRONIC PACKAGES (3-0)
- A comprehensive overview of the fundamental causes for failures in electronic assemblies which include the printed wiring board,package, and second-level assemblies. Failure detection techniques and methodologies, key failure analysis techniques used will be discussed.
- ME5355. MECHANICAL FAILURE OF ELECTRONIC PACKAGES (3-0)
- Failure analysis,fatigue of electronic packages, fracture and creep behavior of solders. Mechanical properties of substrate materials. Electromigration and failure mechanisms.
- ME 5356. CHIP SCALE PACKAGING (3-0)
- Overview of area array packaging with special emphasis on the maturing chip scale packaging technology. Topics covered will iclude the design concepts of this technology, the materials related aspects, the manufacturing processes, and their reliability ina variety of applications.
- Graduate Certificate in Electronic Packaging
Select any 4 courses from the list;
- ME 5317. CONVETION HEAT TRANSFER (3 Credits)
- Equations of motion of viscous fluids are reviewed and the energy equations are introduced. Exact and approximate solutions are made for forced convective problems with non-isothermal and unsteady boundaries. Free convection and combined free- and forced-convection problems are solved.
- ME 5352. FUNDAMENTALS IN ELECTRONIC PACKAGING (3 Credits)
- An introductory treatment of electronic packaging, from single chip to multichip, including materials, electical design, thermal design, mechanical design, package modeling nd simulation, processing considerations, reliability, and testing.
- Prerequisite: Heat Transfer, Material Science and Fluid Dynamics
- ME 5353. COMPUTATIONAL TECHNIQUES FOR ELECTRONIC PACKAGING (3 Credits)
- Characterization of the thermo/mechanical reliability of microelectronics devices using commercial computational heat transfer codes (Icepack, Flotherm, and ANSYS). Industry related problems ranging from first level packages through system level packages analyzed. Formulate and model contemporary problems using commercial CFD codes.
- ME 5390 SPECIAL TOPICS IN MECHANICAL ENGINEERING (3 Credits)
- To provide formal instruction in special topics pertinent to Mechanical Engineering from semester to semester depending on the availability of faculty. May be repeated provided topics differ.
- EE 5355. SILICON INTEGRATED CIRCUIT FABRICATION TECHNOLOGY (3 Credits)
- Basic integrated circuit fabrication processes: crystal growth (thin film and bulk), thermal oxidation, dopant diffusion/implantation, thin film deposition/etching, and lithography. Introduction to process simulators, such as SUPREM. Fabrication and characterization of resistors, MOS capacitors, junction diodes and MOSFET devices. Prerequisite: Pass the NanoFAB Safety and Clean Room Protocol test.
- ME 5344. INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS (MEMS) AND DEVICES (3 Credits)
- Develops the basics for microelectromechanical devices and systems including microsensors, and micromotors, principles of operation, different micromachining techniques, and thin-film technologies as they apply to MEMS.
- ME 6314. FRACTURE MECHANICS (3 Credits)
- Linear elastic fracture mechanics, energy of fracture, mixed mode crack propagation, fatigue crack growth, numerical methods for stress intensity factor determination, damage tolerance and durability design. Offered as AE 6314 and ME 6314. Credit will be granted only once. Prerequisite: AE 5339, ME 5339, or instructor consent.