Past Projects
Under funding from Semiconductor Research Corporation (SRC) and in collaboration with Texas Instruments, EMNSPC research group analyzed the physics of failure for non-standard boards and Surface-mount technology (SMT) packages: Quad-Flat No-leads (QFN), Wafer-level Chip-Scale Package (WCSP) and Ball Grid Array (BGA). An extensive set of material characterization was performed to propose design/material changes to mitigate the failures observed during accelerated thermal cycling and a framework for Board Level Reliability (BLR) was developed.
Location
Box 19018, 500 W. First Street
RM. 211, Woolf Hall
Arlington, Texas 76019-0018
Contact Us
Admin Office Tel: 817- 272-7371
E-Mail: emnspc@uta.edu