Research areas:

  • 3D Packaging

  • Data Center Cooling

  • Thermoelectrics                                                                       

  • Chip Scale Packaging

  • Compact Modeling

  • Computer Aided Electro-Thermo-Mechanical Design

  • Air Cooling 

  • Reliability

Senior Design Projects:

"Data Center Gaseous and Particulate Contamination Corrosion Rate"; Andrew Laffiteau, Moustapha P Niang,Rupesh Phuyal, Laba Pyakurel and Bijay Rijal

"Design of a Bending/Bowing Resistant Heat Sink Back Plate"; Shishir Dhungana, Jonathan Dow, Kinsey Janzen, and Dianne Narzinski