Publications Last Five Years:

  • Mirza, F., Raman, T., Iftakher, A., Iqbal, S., Agonafer, D., “Parametric Thermal Analysis of a 3D Flip Chip Module based on Signal Delay and Silicon Efficiency”,  ITherm, San Deigo, USA, June 2012

  • Lingampalli, S., Mirza, F., Raman, T., Agonafer, D., “Performance Optimization of Multi-Core Processors using Core Hopping - Thermal and Structural”, Semi-Therm 28th, San Jose, California USA, March 2012.

  • Mirza, F., Raman, T., Ghalambor, S., Bastawros, A., Agonafer, D., "Coupled Computational Thermal and Mechanical Analysis of a Single Chip Module with Low-k Dielectric Medium", ASME International Mechanical Engineering Congress & Exposition (IMECE), Denver, CO, November 2011

  • Mirza, F., Muralidharan, B., Mynampati, P., Karajgikar, S., Agonafer, D., "Coupled Thermal and Structural Parametric Analysis of Through Silicon Vias in 3D Electronics" Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  • Mynampati, V.N.P, Karajgikar S., Sheerah I., Agonafer D., Novotny S., Schmidt R., “Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers”, Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  • Mynampati, V.N.P, Mariam F. A.I, Muralidharan B., Menon A.R., Agonafer D., Hendrix M., “Thermally Based Design Optimization of Telecommunication Shelter”, Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  • Raghu, A., Karajgikar, S., Agonafer, D., Sammakia, B., Refai-Ahmed, G., "Thermal Aware Power Migration in Many Core Processors, " Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  • Muralidharan, B., Iqbal Mariam, F A., Mynampati, V.N.P, Menon A.R., "CFD Modeling of Environmental System Options Used for Cooling of Telecommunication Shelters", IHTC 14, 2010, Washington, D.C.

  • Karajgikar, S., Agonafer, D., Ghose, K., Sammakia, B., Amon, C. and Refai-Ahmed, G., “Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture,” Journal of Electronic Packaging, June 2010, Volume 132, Issue 2.

  • Mulay, V., Iqbal Mariam, F. A., Agonafer D., Irwin G., Patell D., "Optimized Chimney Designs for Effective Server Cabinets", IMECE 2009, Orlando, FL.

  • Karajgikar, S., Agonafer, D., Ghose, K., Sammakia, B., Amon, C. and Refai-Ahmed, G., "Effect of Relocation of Functional Units of A Non-uniformly Powered Microprocessor on Thermal and Device Clock Performance," IMECE, Orlando, November, 2009.

  • Mariam, F., Mulay, V., Karajgikar, S., Agonafer, D. and Hendrix, A., "Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers," IMECE, Orlando, November, 2009.

  • Tran, A., Avila, M., Dekeyser, N., Wang, M., Lam, T., Karajgikar, S., Agonafer, D. and Refai-Ahmed, G., "Novel Approaches for Extending Air Cooling Limits for Processors," IMECE, Orlando, November, 2009

  • Mynampati, P., Muralidharan, B., Iqbal, F. and Agonafer, D., "Review of Reliability of Cooling Technologies in the Telecommunications System," IMECE, Orlando, November, 2009.

  • Karajgikar, S., Agonafer, D., Ghose, K., Sammakia, B. and Refai-Ahmed, G., "Development of a Numerical Model for Non-uniformly Powered Die to Improve both Device Clock and Thermal Performance," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Karajgikar, S., Menon, A., Agonafer, D. and Zhang, J., "Optimization of Location of Power Cell For Energy Efficient Operation of Air Cool Drives," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Menon A., Lakhakar, N., Karajgikar, S. and Agonafer, D., "Solder Joint Reliability of Package on Package," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Lakhkar N.R., Banerjee A., Riaz S., Refai-Ahmed G., and Agonafer D., 2009, " Multi-Objective Optimization of a Graphite Heat spreader for Portable systems applications", 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Tran, A., Avila, M., Dekeyser, N., Wang, M., Lam, T., Karajgikar, S., Agonafer, D. and Refai-Ahmed, G., "Novel Approaches for Extending Air Cooling Limits for Processors," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Mulay, V.; Agonafer, D.; Irwin G.,“ Effective Thermal Management of Data Centers Using Efficient Cabinet Designs, ” 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Mulay, V.; Agonafer, D.; Irwin G.,“ Cooling of Data Centers Using Airside Economizers”, 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Muralidharan B., Iqbal-Ahmed F., Mulay V., Agonafer D. and Hendrix M., “Impact of double walled telecommunication cabinet on solar load - natural and forced convection”, 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  • Muralidharan, B., Iqbal Mariam, F.A., Karajgikar S., Agonafer D., Hendrix, M., “Energy Minimization Based fan Configuration for Double Walled Telecommunication Cabinet with Solar Load”, SemiTHERM 2009, Santa Clara, CA.

  • Abhilash R. Menon, Saket Karajgikar and Dereje Agonafer, "Thermal Design Optimization of a Package on Package", SemiTHERM 2009, San Jose, CA, 2009.

  • Feroz Ahamed Iqbal Mariam, Uthaman Raju, Veerendra Mulay, Dereje Agonafer, Deepak Sivanandan and Mark Hendrix, "Thermal Design Considerations of Air-Cooled High Powered Telecommunication Cabinets", SemiTHERM 2009, San Jose, CA, 2009.

  • Kaisare, A.; Agonafer, D.; Haji-Sheikh, A.; Chrysler, G.; Mahajan, R., “Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die,” Journal of Electronic Packaging, March 2009, Volume 131, Issue 1.

  • Karajgikar, S., Rao, S., Sin, J., Popa, D., Chiao, J.-C and Agonafer, D., "Electro-thermal Analysis of In-plane Micropump, IEEE Transactions on Components and Packaging Technologies, Vo. 33, No. 2, pp. 329-339, June 2010.

  • Trivedi, A., D. Sivanandan, D. Agonafer, M. Hendrix, and A. Sahrapour, “Compact Modeling of a Telecommunication Cabinet”, International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Boston, MA.

  • Mulay V., Agonafer D. and Schmidt R., “Liquid Cooling for Thermal Management of Data Centers”, International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Boston, MA.

  • Fasoro, M. Mittal, D. O. Popa, D.A. Agonafer, and H. E. Stephanou “Design for Reliability Applied to Packaging of a MOEMS Switch,” ASME Journal of Electronic Packaging, September 2008.

  • Mohammad M Hossain, Fahad Zahedi, Nikhil Lakhkar, Puligandla Viswanadham, Steven O. Dunford and Dereje Agonafer “Reliability of Tin-Silver-Copper Lead-Free Solder Interconnects Under Mechanical Loading with Different PWB Surface Finishes”, SMTA 2008, August 17 - 21, 2008, Orlando, FL

  • Lakhakar, N., Hossain, M and Agonafer, D., “Rapid Thermo-cycling using Thermoelectric Device: Part I - Hot spot cooling.”, ITherm 2008, May 28 - 31, 2008 in Orlando, Florida.

  • Uthaman, R., Kaisare, A., Haji-Sheikh, A., Agonafer, D., Mahajan, R. and Chrysler, G., “Multi-objective Optimization Entailing Computer Architecture and Thermal Design for Non-uniformly Powered Microprocessors.”, ITherm 2008, May 28 - 31, 2008 in Orlando, Florida.

  • Karajgikar S., Nagaraj V., Agonafer D. and Pekin S., “Flip Chip Back End Design Parameters to Reduce Bump Electromigration,” 58th Electronic Component and Technology Conference, Florida, May 27-30, 2008.

  • Udakeri R., Mulay V., Agonafer D. and Schmidt R., “Comparison of Overhead Supply and Underfloor Supply with Rear Door Heat Exchanger in High Density Data Center Clusters”, Semi-Therm 2008, San Jose, CA, 2008.

  • Agonafer, Dereje, Kaisare, Abhijit, Hossain, Mohammad M., Lee, Yongje, Dewan-Sandur, Bhavani P., Dishongh, Terry and Pekin, Senol (2008) 'Thermo-Mechanical challenges in stacked packaging', Heat Transfer Engineering,29:2, 134 - 148

  • Raju, U; Kaisare, A.; Agonafer, D.; Haji-sheikh, A.; Chrysler, G. ; Mahajan, R. , “Multi-Objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors ,” Thermal and Thermomechanical Phenomena in Electronic Systems, 2008, ITHERM 2008

  • Agonafer D., Kaisare A., Mulay V., Karajgikar S. and Lakhkar N., “Thermomechanical Challenges in Electronic Packaging”, SemiTHERM 2008, San Jose, CA, 2008.

  • Arijit Banerjee, Nikhil Lakhkar, Shahi Riaz, Dereje Agonafer and Gamal Refai-Ahmed, “Multi-Objective parametization of graphite heat spreaders for portable systems applications”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  • Kaisare, A.; Agonafer, D.; Haji-Sheikh, A.; Chrysler, G. INTEL; Mahajan, R. INTEL, “Analytical Approach To Temperature Distribution Of A First Level Package With A Non-Uniformly Powered Die,” International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  • Nagaraj V., Karajgikar S., Agonafer D. and Pekin S., “Bump Electromigration and Back End Design Rules”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  • Mulay V., Karajgikar S., Agonafer D., Iyengar M. and Schmidt R., “Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  • Uthaman R., Agonafer D., “Static Power Consumption – Silicon On Insulator Metal Oxide Semiconductor Field Effect Transistor”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  • Trivedi, A.; Tadepalli, C.; Kaisare, A.; Agonafer D.; Refai-Ahmed, G. AMD, “Effect of weight of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array package,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  • Kaisare, A.; Agonafer, D.; Haji-sheikh, A.; Chrysler, G. INTEL; Mahajan, R. INTEL, “Numerical model for design of non uniform powered microprocessors using multi-objective optimization based on both thermal and device clock performance ,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  • Mulay, V.; Karajgikar, S.; Iyengar, M.IBM; Agonafer, D.; Schmidt, R.IBM,“ Computational study of hybrid cooling solution for thermal management of data centers, ” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  • Lakhkar, N.; Fasoro, A.; Patil, A.; Lee, W.H.; Popa, D.; Stephanou, H.; Agonafer, D., “Process development and die shear testing in MOEMS packaging,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  • Trivedi, A.; Lakhkar, N.; Agonafer, D.; Iyengar, M. IBM; Ellsworth, M Jr. IBM; Schmidt, R. IBM ,“Experimental and Computational Characterization of a Heat sink Tester,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  • Lakhkar, N.; Hossain, M.; Puligandla V.; Agonafer, D., “Mechanical characterization of lead SAC lead free solder with gold addition under tensile loading,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  • Fasoro, A.; Pandojirao, P.; Lee, W.H.; Popa, D.; Stephanou, H.; Agonafer, D., “die and wafer-level hermetic for MEMS applications,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  • Paruchuri, Srikar, Sin, Jeongsik, Graff, Mason and Agonafer, D., “Flexible PDMS Chip with Embedded In-plane Valves for Microfluidic Manipulations,” 5th International Conference on Nanochannels, Microchannels and Minichannels, June 18-20, 2007, Puebla, Mexico.

  • Hossain, M.M., Sudhakar Jagarkal, Dereje Agonafer, Menberu Lulu, and Stefan Reh, “Design Optimization and Reliability of PWB Level Electronic Package”, Journal of Electronic Packaging, March 2007,Volume 129, Issue 1, pp. 9-18 .

  • Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, and Bahgat Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” Journal of Electronic Packaging, Transactions of the ASME, v 128, Issue 4, December 2006, pp. 380-387

  • Kaisare, Abhijit, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, and Ravi Mahajan, “Approximate Analytical Model for a First Level Package with Non-Uniformly Powered Die,” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  • Hossain, Mohammad, Dereje Agonafer, Viswanadham Puligandla, and Tommi Reinikainen, “Deformation Characteristics and Constitutive Relationship of SnAgCu Lead Free Solder Alloys under Thermo-mechanical and Mechanical Loading.” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  • Sung, Baekyoung, Chepuri Krishna Teja, Venkata, Yongje Lee, Dereje Agonafer, Damena Agonafer, and Cristina Amon, “Thermal Enhancement of Stacked Dies Using Thermal Vias.” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  • Bhopte, Siddharth, Madhusudan K. Iyengar, Bahgat Sammakia, Roger Schmidt and Dereje Agonafer, “Numerical Modeling of Data Center Clusters – Impact of Model Complexity”, International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  • Bhopte, Siddharth, Madhusudan Iyengar, Bahgat Sammakia, Roger Schmidt and Dereje Agonafer, “Effect of Under Floor Parameters on Data Center Performance”, Honorary Symposium for Dr. Suhas V. Patankar, International Mechanical Engineering Congress and Exposition 2006, November 5-10, 2006, Chicago Hilton.

  • Kaisare, A., Dereje Agonafer, A. Haji-Sheikh, Ravi Mahajan and Greg Chrysler, “Analytical approach to temperature distribution of a first level package with a non-uniformly powered processor”, ITHERM May 30-June 2, 2006, Sheraton San Diego Hotel and Marina.

  • Bhopte, Siddharth, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt and Dereje Agonafer, “Effect of Under-Floor Blockages on Data Center Performance”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  • Sandur, Bhavani P.D., Abhijit Kaisare, Dereje Agonafer, University of Texas-Arlington, USA, Damena Agonafer, Cristina Amon, Carnegie Mellon University; and Terry Dishongh, Intel Corporation, “Thermal Management of Stacked Die that Includes Memory and Logic Processors”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  • Hossain, Mohammad M. Fahad Zahedi, Dereje Agonafer, Viswam Puligandla, Tommi Reinikainen, Steven Dunford, “Reliability of lead free SAC solder interconnects under mechanical loading with different PWB surface finishes”, ITHERM May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA

  • Hossain, M.M., Y.C. Lee, Roksana Akhter, Dereje Agonafer, Senol Pekin, and Terry Dishongh, “Solder Joint Fatigue Life Predictions varying the Die Stacking Architectures for Flash Memory Applications”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA

  • Abiodun A. Fasoro, Dan O. Popa, Heather Beardsley, Jeongsik Sin, Dereje Agonafer, Harry E. Stephanou and Michael A. Deeds, “Fluxless Optical Fiber Attachment for Hermetic MOEMS Applications,” ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  • Bedekar, Vishwas, Saket Karajgikar, Dereje Agonafer, Madhusudan Iyengar and Roger Schmidt, “Effect of Crac Location on Fixed Rack Layout,” ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  • Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, Dereje Agonafer and Harry Stephanou, “Design of Polymer Tube Embedded In-Plane Micropump,” May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  • Borovic, Bruno, Frank L. Lewis, Hossain, M.M., and Dereje Agonafer, “Robust Multiphysics FEA Methodology for Extracting a Reduced-Order Model of MEMS Thermal Actuators”, published in ECTC, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  • Hossain, M.M., Y. Lee, Roksana Akhter, Dereje Agonafer, Senol Pekin, and Terry Dishongh, “Reliability of Stack Packaging Varying the Die Stacking Architectures for Flash Memory Applications”, SemiTHERM, March 12-16, 2006, Dallas, TX.

  • Kaisare, Abhijit, Dereje Agonafer, A Haji-Shiekh, Ravi Mahajan and Greg Chrysler, “Design Rule For Minimizing Thermal Resistance In A Non–uniformly Powered Microprocessor”, SemiTHERM, March 12-16, 2006, Dallas TX.

  • Borovic, Bruno, Frank L. Lewis, Dereje Agonafer, Edward S. Kolesar, Mohammad M. Hossain, Dan O. Popa, “Method for Determining a Dynamical State Space Model for Control of Thermal MEMS Devices,” Journal of Microelectromechanical Systems, Vol. 14, Issue 5, October 2005, p 961-970.

  • Lakhkar, Nikhil R., Madhusudan Iyengar, Michael Ellsworth Jr., and Dereje Agonafer, “Design of a cold plate tester for accurate measurement of thermal performance,” Proceedings of International Mechanical Engineering Congress and Exposition-05 Orlando FL, November 5-11, 2005.

  • Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, Dereje Agonafer and Harry Stephanou. “Polymer tube embedded in-plane micropump: design, analysis and fabrication.” Proceedings of International Mechanical Engineering Congress and Exposition-05 Orlando FL, November 5-11, 2005.

  • Akhter, Roksana, Bhavani P.D. Sandur, Mohammad Hossain, Abhijit Kaisare, Dereje Agonafer, Kent Lawrence and Terry Dishongh, “Design for Stackability of Flash Memory Devices Based on Thermal Optimization”, Proceedings of 24th Digital Avionics Systems Conference, Washington, D.C., October 30 – November 3, 2005

  • Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, and Dereje Agonafer, “Polymer Tube Embedded In-Plane Micropump for Low Flow Rate”, Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, and Dereje Agonafer. Proceedings of 24th Digital Avionics Systems Conference, Washington, D.C., October 30 – November 3, 2005.

  • Refai-Ahmed, Gamal and Dereje Agonafer, “Thermal Road map for Telecom Equipment,” ASHRAE Transactions, v 111 n 1, 2005, p 913-920

  • Bhopte, Siddharth, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,”. InterPACK’05 Conference, San Francisco, CA, July 17-22, 2005.

  • Karajgikar, Saket, Wonkee Ahn, and Dereje Agonafer, “Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage,” InterPACK’05 Conference, San Francisco, CA, July 17-22, 2005.

  • Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, A., Chrysler, Greg, and Mahajan, Ravi, “Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK’05, San Francisco, CA, July 17-22, 2005.

  • Hossain, Mohammad, Agonafer, Dereje, Puligandla, Viswanadham, and Reinikainen, Tommi, “Lead-Free and Sn/Pb Solders Alloy Behavior under Cyclic Bending,” InterPACK’05, San Francisco, CA, July 17-22, 2005.

  • Karajgikar, Saket; Lakhkar, Nikhil; Agonafer, Dereje; Schmidt, Roger, “Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: Computational and experimental”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 95-100

  • Mulay, Veerendra; Kulkarni, Amit; Agonafer, Dereje; Schmidt, Roger, “Effect of the location and the properties of thermostatic expansion valve sensor bulb on the stability of a refrigeration system”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 85-94

  • Amon, Cristina; Agonafer, Dereje, “Foreword: Special issue on electronic cooling”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 1

  • Bhopte, Siddharth; Alshuqairi, Musa S.; Agonafer, Dereje; Refai-Ahmed, Gamal, “Mixed convection of impinging air cooling over heat sink in telecom system application”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 519-523

  • Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, “Methodology for an integrated (electrical/mechanical) design of PWBA”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 524-527

  • 82 Wang, P., Huang, G., Ching, H., Hsu, H., Novotny, S., Ahn, W., and Agonafer, D., “µPGA Socket and Solder Joint Reliability Study”, 2004, Proc. of Pan Pacific Electronic Conference and SMTA, 3, Kauai, Hawaii, pp. 67–84.

  • Makwana, Yasin; Agonafer, Dereje; Manole, Dan, “Impact of TXV and compressor in the stability of a high-end computer refrigeration system”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 554-559

  • Sammakia, Bahgat; Agonafer, Dereje, “Journal of Electronic Packaging, Transactions of the ASME: Foreword”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4,December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 409

  • Agonafer, Damena; Ibarra, Juan; McGee, Kendrick; Platt, Frank; Harris, Kendall; Agonafer, Dereje, “Heat pipe optimization team the heat pipe assisted heat sink project”, Innovations in Engineering Education 2004: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, Innovations in Engineering Education 2004:Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, 2004, p 363-372

  • Kuravi, Suma; Agonafer, Dereje, “Validation of ASHRAE equation to find evaporation rates in humid cavity”, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 375, n 2, Proceedings of the ASME Heat Transfer Division - 2004, 2004, p 109-116

  • Xu, Leon (NOKIA Inc., MS 3-4-1400); Reinikainen, Tommi; Ren, Wei; Wang, Bo Ping; Han, Zhenxue; Agonafer, Dereje, “A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending”, Microelectronics Reliability, v 44, n 12, December, 2004, p 1977-1983

  • Hossain, Mohammad M; Agonafer, Dereje; Viswanadham, Puligandla; Reinikainen, Tommi, “Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 358-367

  • Jagarkal, Sudhakar G.; Hossain, Mohammad Masum; Agonafer, Dereje; Lulu, Menberu; Reh, Stefan, “Design optimization and reliability of PWB level electronic package”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 368-376

  • Borovic, Bruno; Lewis, Frank L.; Hossain, Mohammad M.; Agonafer, Dereje; Kolesar, Edward S., “Experimentally verified procedure for determining dynamical model of the ETM MEMS structures”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 541-548

  • Halvi, Ananth Srivatsav; Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, “Simulation of PWB warpage during fabrication and due to reflow”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 674-678

  • Karajgikar, Saket; Lakhkar, Nikhil; Agonafer, Dereje; Schmidt, Roger, “Impact of area contact between sensor bulb and evaporator return line on MRU - Part II, experimental work”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 1, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 232-236

  • Haji-Sheikh, A.; Beck, J.V.; Agonafer, D., “Steady-state heat conduction in multi-layer bodies”, International Journal of Heat and Mass Transfer, v 46, n 13, June, 2003, p 2363-2379

  • Makwana, Yasin; Agonafer, Dereje; Manole, Dan, “Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 533-538

  • Lakhkar, Nikhil; Karajgikar, Saket; Agonafer, Dereje; Schmidt, Roger, “The impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit - Part I, Computational Study”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 651-656

  • Novotny, Shlomo; Ahn, Wonkee; Agonafer, Dereje, “A Methodology for an Integrated (Electrical/Mechanical) Design of PWBA”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 721-727

  • Alshuqairi, Musa S; Refai-Ahmed, Gamal; Agonafer, Dereje, “Mixed Convection of Impinging Air Cooling over Heat Sink in Telecom System Application”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 777-783

  • Hossain, Mohammad Masum; Agonafer, Dereje; Viswanadham, Puligandla; Reinikainen, Tommi, “The effect of intermetallic compound in solder joint fatigue life prediction using finite element modeling”, Advances in Electronic Packaging, v 1, Advances in Electronic Packaging 2003: Volume 1, 2003, p 853-862

  • Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, Advances in Electronic Packaging, “The Impact of Board Layout and Layup on PWB Warpage during fabrication and due to Reflow Solder Process: A Review of Literature”, v 1, Advances in Electronic Packaging 2003: Volume 1, 2003, p 863-877

  • Guggari, Shrishail; Agonafer, Dereje; Beady, Christian; Stahl, Lennart, “A hybrid methodology for the optimization of data center room layout”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 605-612

  • Kulkarni, Amit; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part II”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 613-619

  • Kulkarni, Amit; Agonafer, Dereje; Groothuis, Steven; Kabir, Humayun; Johnson, S., “Package and board level study for a thin small outline package (TSOP) using compact components”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 867-873.

  • Mulay, Veerendra; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system”, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 374, n 2, Proceedings of the ASME Heat Transfer Division – 2003

  • Nnanna, A.G. Agwu; Haji-Sheikh, A.; Agonafer, D., “Effect of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces”, Journal of Electronic Packaging, Transactions of the ASME, v 125, n 3, September, 2003, p 456-460

  • Ellsworth Jr., M.J., Schmidt, R.R., Agonafer, D., “Design and Analysis of a Scheme to Mitigate Condensation on an Assembly used to Cool Processor Module”, IBM Journal of Research and Development, v 46, n 6, November 2002, p 753-760.

  • Agonafer, Dereje, “Foreword”, Thermal Management of Microelectronic Equipment, 2002, p xxiii

  • Agwu Nnanna, A.G; Haji-Sheikh, A.; Agonafer, D., “Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 292-297

  • Kulkarni, A.; Mulay, Veerendra; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part I”, Thermomechanical Phenomena in Electronic Systems -Proceedings of The Intersociety Conference, 2002, p 403-407

  • Kaisare, Abhijit; Han, Zhenxue; Agonafer, Dereje; Ramakrishna, K., “Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 926-931

  • “Foreword”, Agonafer, Dereje, Thermal Management of Microelectronic Equipment, 2002, p xxiii

  • “Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces”, Agwu Nnanna, A.G; Haji-Sheikh, A.; Agonafer, D., Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 292-297

  • “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part I”, Kulkarni, A.; Mulay, Veerendra; Agonafer, Dereje; Schmidt, Roger, Thermomechanical Phenomena in Electronic Systems -Proceedings of The Intersociety Conference, 2002, p 403-407

  • “Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package”, Kaisare, Abhijit; Han, Zhen-Xue; Agonafer, Dereje; Ramakrishna, K., Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 926-931

  • “Message from the: Electronics and Photonics Packaging Division Chair”, Agonafer, Dereje, Advances in Electronic Packaging, v 1, 2001, p ii

  • “Message from the Electronics and Photonics Packaging Division Chair”, Agonafer, Dereje, Advances in Electronic Packaging, v 2, 2001, p ii

  • “Message from the Electronics and Photonics Packaging Division Chair”, Agonafer, Dereje, Advances in Electronic Packaging, v 3, 2001, p ii

  • “Numerical prediction of the thermal resistance of cold plate”, Agonafer, Dereje; Han, Zhen-Xue; Schmidt, Roger, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging; Thermal Management Reliability, 2001, p 983-987

  • “Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study”, Agwu Nnanna, A.G.; Agonafer, Dereje; North, Mark T., Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1763-1768

  • “Numerical studies on chimney-enhanced natural convection”, Han, Zhen-Xue; Agonafer, Dereje, Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1769-1774

  • “Numerical simulations of the natural convective heat transfer inside an electronic device”, Han, Zhen-Xue; Agonafer, Dereje, Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1775-1780

  • “A three dimensional thermo-mechanical analysis of a BGA package”, Kaisare, Abhijit D; Agonafer, Dereje; Lam, Patrick, Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1781-1785