Latest Publications:

2018

  1. Dereje Agonafer, James Beck, Kevin Cole, W. J. Minkowycz, Filippo de Monte, Robert McMasters, and Keith Woodbury. Professor A. Haji-Sheikh on His 85th Birthday. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER 123 (August 2018): 1253–54.

  2. Al Khazraji, Ahmed, Ahmed Al Khazraji, Ashwin Siddarth, Mullaivendhan Varadharasan, Abhishek Guhe, Dereje Agonafer, James Hoverson, and Mike Kaler. Experimental Characterization of Vertically Split Distribution Wet- Cooling Media Used in the Direct Evaporative Cooling of Data Centers. 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018.

  3. Denria, Jyotirmoy, Pavan Rajmane, and Dereje Agonafer. Board Level Solder Joint Reliability Assessment Study of Megtron 6 Vs FR-4 Under Power Cycling and Thermal Cycling. 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018.

  4. Dhadve, Mangesh, Jimil M. Shah, and Dereje Agonafer. CFD Simulation and Optimization of the Cooling of Open Compute Machine Learning ‘Big Sur‘ Server. 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018.

  5. Kasukurthy, Rajesh, Pencala S. Challa, Rishi Ruben Palanikumar, Barath Ragul Manimaran, and Dereje Agonafer. Flow Analysis and Linearization of Rectangular Butterfly Valve Flow Control Device for Liquid Cooling. 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018.

  6. Siddarth, Ashwin, Richard Eiland, John Edward Fernandes, and Dereje Agonafer. Impact of Static Pressure Differential Between Supply Air and Return Exhaust on Server Level Performance. 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018.

  7. Adejokun, F., Siddarth, A., Guhe, A. and Agonafer, D., 2018, August. Weather Analysis Using Neural Networks for Modular Data Centers. In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (pp. V001T02A001-V001T02A001). American Society of Mechanical Engineers.

  8. Varadharasan, M., Agonafer, D., Al Khazraji, A., Shah, J., Siddarth, A., Hoverson, J. and Kaler, M., 2018, August. A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers. In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (pp. V001T02A008-V001T02A008). American Society of Mechanical Engineers

  9. Walekar, A., Siddarth, A., Guhe, A., Sukthankar, N., Agonafer, D., 2018. Neural Network Based Bin Analysis for Indirect/Direct Evaporative Cooling of Modular Data Centers, in: Proceedings of the ASME 2018 International Mechanical Engineering Congress and Exposition. Presented at the IMECE2018, ASME, Pittsburgh, PA, USA.

  10. Dakshinamurthy, H.N., Siddarth, A., Guhe, A., Kasukurthy, R., Hoverson, J., Agonafer, D., 2018. Accelerated Degradation Testing of Rigid Wet Cooling Media to Analyze the Impact of Calcium Scaling. in: Proceedings of the ASME 2018 International Mechanical Engineering Congress and Exposition. Presented at the IMECE2018, ASME, Pittsburgh, PA, USA.

  11. Chowdhury, U., Siddarth, A., Sahini, M., Agonafer, D., 2018. Raising Inlet Air Temperature for a Hybrid-Cooled Server Retrofitted with Liquid Cooled Cold Plates. in: Proceedings of the ASME 2018 International Mechanical Engineering Congress and Exposition. Presented at the IMECE2018, ASME, Pittsburgh, PA, USA.

  12. Misrak, A., Nguyen, L., Kummerl, S. and Agonafer, D., 2018. Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation. Journal of Microelectronics and Electronic Packaging, 15(2), pp.95-100.

  13. Sahini, M. and Agonafer, D., 2018. Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis. Journal of Microelectronics and Electronic Packaging, 15(1), pp.21-34.

  14. Thirunavakkarasu, G., Saini, S., Shah, J. and Agonafer, D., 2018, August. Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization. In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (pp. V001T02A011-V001T02A011). American Society of Mechanical Engineers

2017

  1. Chowdhury, Uschas, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, and Steve Branton. CHARACTERIZATION OF AN ISOLATED HYBRID COOLED SERVER WITH FAILURE SCENARIOS USING WARM WATER COOLING. In PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017. Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. THREE PARK AVENUE, NEW YORK, NY 10016-5990 USA: AMER SOC MECHANICAL ENGINEERS, 2017.

  2. Eiland, Richard, John Edward Fernandes, Bharath Nagendran, Veerendra Mulay, and Dereje Agonafer. Effectiveness of Rack-Level Fans-Part I: Energy Savings Through Consolidation. JOURNAL OF ELECTRONIC PACKAGING 139, no. 4 (December 2017).

  3. Eiland, Richard, John Edward Fernandes, Marianna Vallejo, Ashwin Siddarth, Dereje Agonafer, and Verrendra Mulay. Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions. JOURNAL OF ELECTRONIC PACKAGING 139, no. 4 (December 2017).

  4. Fernandes, John Edward, Richard Eiland, Bharath Nagendran, Veerendra Mulay, and Dereje Agonafer. Effectiveness of Rack-Level Fans-Part II: Control Strategies and System Redundancy. JOURNAL OF ELECTRONIC PACKAGING 139, no. 4 (December 2017).

  5. Gupta A, Sridhar A, Agonafer D. CFD Optimization of the Cooling of Yosemite Open Compute Server. ASME. International Electronic Packaging Technical Conference and Exhibition, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems ():V001T02A011. doi:10.1115/IPACK2017-74254.

  6. Islam, Md Malekkul, Uschas Chowdhury, Neha Inamdar, and Dereje Agonafer. Power Consumption Minimization in Hybrid Cooled Server by Fan Reduction. In PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 850–56. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  7. Misrak, Abel, Avinash Anaskure, A. R. Nazmus Sakib, Unique Rahangdale, Alok Lohia, and Dereje Agonafer. Comparison of the Effect of Elastic and Viscoelastic Modeling of PCBs on the Assessment of Board Level Reliability. In PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 1106–10. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  8. Rahangdale, Unique, B. Conjeevaram, Aniruddha Doiphode, Pavan Rajmane, Abel Misrak, A. R. Sakib, Dereje Agonafer, Luu T. Nguyen, Alok Lohia, and Steven Kummerl. Solder Ball Reliability Assessment of WLCSP - Power Cycling Versus Thermal Cycling. In PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 1361–68. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  9. Rahangdale, Unique, Pavan Rajmane, Aniruddha Doiphode, A. R. Sakib, Abel Misrak, Alok Lohia, and Dereje Agonafer. Damage Progression Study of 3D TSV Package during Reflow, Thermal Shocks and Thermal Cycling. In PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 1119–25. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  10. Rahangdale, Unique, Pavan Rajmane, Abel Misrak, and Dereje Agonafer. A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing with Package Power Supply. In PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017. Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. THREE PARK AVENUE, NEW YORK, NY 10016–5990 USA: AMER SOC MECHANICAL ENGINEERS, 2017.

  11. Rahangdale, Unique et. al. Reliability Analysis of Ultra-Low-k Large-Die Package & Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading. In PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017. Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. THREE PARK AVENUE, NEW YORK, NY 10016–5990 USA: AMER SOC MECHANICAL ENGINEERS, 2017.

  12. Rahangdale, Unique, A. R. Sakib, Mugdha Chaudhari, Abel Misrak, Chaitanya Dave, Dereje Agonafer, Alok Lohia, Steven Kummerl, and Luu T. Nguyen. Mechanical Characterization of RCC and FR4 Laminated PCBs and Assessment of Their Board Level Reliability. In PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 1111–18. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  13. Rahangdale, Unique, Rahul Srinivas, S. Krishnamurthy, Pavan Rajmane, Abel Misrak, A. R. Sakib, Dereje Agonafer, Alok Lohia, Steven Kummerl, and Luu T. Nguyen. Effect of PCB Thickness on Solder Joint Reliability of Quad Flat No-Lead Assembly under Power Cycling and Thermal Cycling. In 2017 THIRTY-THIRD ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 70–76. Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  14. Rahul, Varun, Anay Darekar, Rajesh Kasukurthy, Ashwin Sidharth, and Dereje Agonafer. NiyanTron - An Approach to Develop a Control System App for Data Center Cooling. In PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 952–59. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  15. Rajmane, Pavan, Hassaan Ahmad Khan, Aniruddha Doiphode, Unique Rahangdale, Dereje Agonafer, Alok Lohia, Steven Kummerl, and Luu Nguyen. Failure Mechanisms of Boards in a Thin Wafer Level Chip Scale Package. In PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 1099 – 1105. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 345 E 47TH ST, NEW YORK, NY 10017 USA: IEEE, 2017.

  16. Sahini, Manasa, Dereje Agonafer, and Vijayalan Pandiyan. THERMAL PERFORMANCE EVALUATION OF THREE TYPES OF NOVEL END-OF AISLE COOLING SYSTEMS. In PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017. Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. THREE PARK AVENUE, NEW YORK, NY 10016 – 5990 USA: AMER SOC MECHANICAL ENGINEERS, 2017.

2014

  1. Eiland, R., Fernandes, J., Vallejo, M., Agonafer, D., Mulay, V., Performance of a High Density Mineral Oil Immersion Cooled Server System, Los Gatos, CA, IMAPS ATW Thermal Management 2014

  2. Eiland, R., Fernandes, J., Vallejo, M., Agonafer, D., Mulay, V., Flow Rate and Inlet Temperature Considerations for Direct Immersion of a Single Data Center Server in White Mineral Oil, San Diego, CA, ITHERM 2014

2013

  1. Gebrehiwot, B., Dhiman, N., Rajagopalan, K., Agonafer, D., Kannan, N., Hoverson, J., Kaler, M. (2013) CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications. Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME

  2. Gebrehiwot, B., Dhiman, N., Rajagopalan, K., Agonafer, D., Kannan, N., Hoverson, J., & Kaler, M. (2013). CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications. Proceedings of ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (pp. V002T08A054-V002T08A054). American Society of Mechanical Engineers (ASME)

  3. Fernandes, J., Ghalambor, S., Docca, A., Aldham, C., Agonafer, D., Chenelly, E., Chan, B., Ellsworth, M. Jr., (2013). Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design. Proceedings of InterPACK 2013, San Francisco

  4. Ghalambor S., Fernandes J., Agonafer D. and Mulay V., (2013). Improving the Thermal Performance of a Forced Convection Air Cooled Solution – Part 1: Modification of Heat Sink Assembly. Proceeding of the 12th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), July 16-18 2013, Burlingame, CA

  5. Fernandes J., Ghalambor S., Eiland R., Agonafer D. and Mulay V., (2013). Improving the Thermal Performance of a Forced Convection Air Cooled Solution – Part 2: Effect on System-Level Performance. Proceeding of the 12th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), July 16 - 18 2013, Burlingame, CA

  6. Fernandes J., Ghalambor S., Docca A., Aldham C., Agonafer D., Chenelly E., Chan B. and Ellsworth M.J., (2013). Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design of a Multi-Chip Module (MCM) Cold Plate. Proceedings of the 12th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), July 16 - 18 2013, Burlingame, CA

2012

  1. Gebrehiwot, B., Aurangabadkar, K., Kannan, N., Agonafer, D., Sivanandan, D., Hendrix, M., (2012) CFD Analysis of Free Cooling of Modular Data Centers. Proceedings of the Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE , vol., no., pp.108-111, 18-22 March 2012

  2. Gebrehiwot, B., Aurangabadkar, K., Kannan, N., Agonafer, D., Sivanandan, D., & Hendrix, M. (2012). CFD Analysis of Free Cooling of Modular Data Centers. Proceeding of the Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE (pp. 108-111). IEEE

  3. Mirza, F., Raman, T., Iftakher, A., Iqbal, S., Agonafer, D., Parametric Thermal Analysis of a 3D Flip Chip Module based on Signal Delay and Silicon Efficiency, ITherm, San Deigo, USA, June 2012

  4. Lingampalli, S., Mirza, F., Raman, T., Agonafer, D., Performance Optimization of Multi-Core Processors using Core Hopping - Thermal and Structural, Semi-Therm 28th, San Jose, California USA, March 2012

2011

  1. Mirza, F., Raman, T., Ghalambor, S., Bastawros, A., Agonafer, D., Coupled Computational Thermal and Mechanical Analysis of a Single Chip Module with Low-k Dielectric Medium, ASME International Mechanical Engineering Congress & Exposition (IMECE), Denver, CO, November 2011

  2. Chauhan, A., Sammakia, B., Afram, F., Ghose, K., Ahmed, G., Agonafer, D., Liquid Cooling of a Stacked Quad-Core Processor and Dram Using Laminar Flow in Microchannels Proceedings of IMECE 2011, November 11-17,Denver, Colorado

  3. Rodrigo, N., Haji-Sheikh, A., Agonafer, D., Ghalambor, S., Analytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package Proceedings of IMECE 2011, November 11- 17,Denver, Colorado

  4. Romero, D., Nabovati, A., Refai-Ahmed, G., Sellan, D.P., Ghalambor, S., Shah, N., Agonafer, D., Amon, C.H., Enhanced Thermal Map Prediction and Floor-Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects, InterPACK 2011, July 6-8, Portland, OR

  5. Phan, H.N., Agonafer, D., Thermoelectric Cooling Analysis Using Modified-Graphical- Method (MGM) for Multidimensional-Heat-Transfer-System (MHTS), Journal of Electronic Packaging, 2011

Other Publications

  1. Mirza, F., Muralidharan, B., Mynampati, P., Karajgikar, S., Agonafer, D., "Coupled Thermal and Structural Parametric Analysis of Through Silicon Vias in 3D Electronics" Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  2. Mynampati, V.N.P, Karajgikar S., Sheerah I., Agonafer D., Novotny S., Schmidt R., “Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers”, Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  3. Mynampati, V.N.P, Mariam F. A.I, Muralidharan B., Menon A.R., Agonafer D., Hendrix M., “Thermally Based Design Optimization of Telecommunication Shelter”, Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  4. Raghu, A., Karajgikar, S., Agonafer, D., Sammakia, B., Refai-Ahmed, G., "Thermal Aware Power Migration in Many Core Processors, " Proceedings of IMECE 2010, November 12-18,Vancouver, British Columbia

  5. Muralidharan, B., Iqbal Mariam, F A., Mynampati, V.N.P, Menon A.R., "CFD Modeling of Environmental System Options Used for Cooling of Telecommunication Shelters", IHTC 14, 2010, Washington, D.C.

  6. Karajgikar, S., Agonafer, D., Ghose, K., Sammakia, B., Amon, C. and Refai-Ahmed, G., “Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture,” Journal of Electronic Packaging, June 2010, Volume 132, Issue 2.

  7. Mulay, V., Iqbal Mariam, F. A., Agonafer D., Irwin G., Patell D., "Optimized Chimney Designs for Effective Server Cabinets", IMECE 2009, Orlando, FL.

  8. Karajgikar, S., Agonafer, D., Ghose, K., Sammakia, B., Amon, C. and Refai-Ahmed, G., "Effect of Relocation of Functional Units of A Non-uniformly Powered Microprocessor on Thermal and Device Clock Performance," IMECE, Orlando, November, 2009.

  9. Mariam, F., Mulay, V., Karajgikar, S., Agonafer, D. and Hendrix, A., "Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers," IMECE, Orlando, November, 2009.

  10. Tran, A., Avila, M., Dekeyser, N., Wang, M., Lam, T., Karajgikar, S., Agonafer, D. and Refai-Ahmed, G., "Novel Approaches for Extending Air Cooling Limits for Processors," IMECE, Orlando, November, 2009

  11. Mynampati, P., Muralidharan, B., Iqbal, F. and Agonafer, D., "Review of Reliability of Cooling Technologies in the Telecommunications System," IMECE, Orlando, November, 2009.

  12. Karajgikar, S., Agonafer, D., Ghose, K., Sammakia, B. and Refai-Ahmed, G., "Development of a Numerical Model for Non-uniformly Powered Die to Improve both Device Clock and Thermal Performance," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  13. Karajgikar, S., Menon, A., Agonafer, D. and Zhang, J., "Optimization of Location of Power Cell For Energy Efficient Operation of Air Cool Drives," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  14. Menon A., Lakhakar, N., Karajgikar, S. and Agonafer, D., "Solder Joint Reliability of Package on Package," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  15. Lakhkar N.R., Banerjee A., Riaz S., Refai-Ahmed G., and Agonafer D., 2009, " Multi-Objective Optimization of a Graphite Heat spreader for Portable systems applications", 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  16. Tran, A., Avila, M., Dekeyser, N., Wang, M., Lam, T., Karajgikar, S., Agonafer, D. and Refai-Ahmed, G., "Novel Approaches for Extending Air Cooling Limits for Processors," 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  17. Mulay, V.; Agonafer, D.; Irwin G.,“ Effective Thermal Management of Data Centers Using Efficient Cabinet Designs, ” 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  18. Mulay, V.; Agonafer, D.; Irwin G.,“ Cooling of Data Centers Using Airside Economizers”, 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  19. Muralidharan B., Iqbal-Ahmed F., Mulay V., Agonafer D. and Hendrix M., “Impact of double walled telecommunication cabinet on solar load - natural and forced convection”, 2009 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09, July 19-23, 2009.

  20. Muralidharan, B., Iqbal Mariam, F.A., Karajgikar S., Agonafer D., Hendrix, M., “Energy Minimization Based fan Configuration for Double Walled Telecommunication Cabinet with Solar Load”, SemiTHERM 2009, Santa Clara, CA.

  21. Abhilash R. Menon, Saket Karajgikar and Dereje Agonafer, "Thermal Design Optimization of a Package on Package", SemiTHERM 2009, San Jose, CA, 2009.

  22. Feroz Ahamed Iqbal Mariam, Uthaman Raju, Veerendra Mulay, Dereje Agonafer, Deepak Sivanandan and Mark Hendrix, "Thermal Design Considerations of Air-Cooled High Powered Telecommunication Cabinets", SemiTHERM 2009, San Jose, CA, 2009.

  23. Kaisare, A.; Agonafer, D.; Haji-Sheikh, A.; Chrysler, G.; Mahajan, R., “Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die,” Journal of Electronic Packaging, March 2009, Volume 131, Issue 1.

  24. Karajgikar, S., Rao, S., Sin, J., Popa, D., Chiao, J.-C and Agonafer, D., "Electro-thermal Analysis of In-plane Micropump, IEEE Transactions on Components and Packaging Technologies, Vo. 33, No. 2, pp. 329-339, June 2010.

  25. Trivedi, A., D. Sivanandan, D. Agonafer, M. Hendrix, and A. Sahrapour, “Compact Modeling of a Telecommunication Cabinet”, International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Boston, MA.

  26. Mulay V., Agonafer D. and Schmidt R., “Liquid Cooling for Thermal Management of Data Centers”, International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Boston, MA.

  27. Fasoro, M. Mittal, D. O. Popa, D.A. Agonafer, and H. E. Stephanou “Design for Reliability Applied to Packaging of a MOEMS Switch,” ASME Journal of Electronic Packaging, September 2008.

  28. Mohammad M Hossain, Fahad Zahedi, Nikhil Lakhkar, Puligandla Viswanadham, Steven O. Dunford and Dereje Agonafer “Reliability of Tin-Silver-Copper Lead-Free Solder Interconnects Under Mechanical Loading with Different PWB Surface Finishes”, SMTA 2008, August 17 - 21, 2008, Orlando, FL

  29. Lakhakar, N., Hossain, M and Agonafer, D., “Rapid Thermo-cycling using Thermoelectric Device: Part I - Hot spot cooling.”, ITherm 2008, May 28 - 31, 2008 in Orlando, Florida.

  30. Uthaman, R., Kaisare, A., Haji-Sheikh, A., Agonafer, D., Mahajan, R. and Chrysler, G., “Multi-objective Optimization Entailing Computer Architecture and Thermal Design for Non-uniformly Powered Microprocessors.”, ITherm 2008, May 28 - 31, 2008 in Orlando, Florida.

  31. Karajgikar S., Nagaraj V., Agonafer D. and Pekin S., “Flip Chip Back End Design Parameters to Reduce Bump Electromigration,” 58th Electronic Component and Technology Conference, Florida, May 27-30, 2008.

  32. Udakeri R., Mulay V., Agonafer D. and Schmidt R., “Comparison of Overhead Supply and Underfloor Supply with Rear Door Heat Exchanger in High Density Data Center Clusters”, Semi-Therm 2008, San Jose, CA, 2008.

  33. Agonafer, Dereje, Kaisare, Abhijit, Hossain, Mohammad M., Lee, Yongje, Dewan-Sandur, Bhavani P., Dishongh, Terry and Pekin, Senol (2008) 'Thermo-Mechanical challenges in stacked packaging', Heat Transfer Engineering,29:2, 134 - 148

  34. Raju, U; Kaisare, A.; Agonafer, D.; Haji-sheikh, A.; Chrysler, G. ; Mahajan, R. , “Multi-Objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors ,” Thermal and Thermomechanical Phenomena in Electronic Systems, 2008, ITHERM 2008

  35. Agonafer D., Kaisare A., Mulay V., Karajgikar S. and Lakhkar N., “Thermomechanical Challenges in Electronic Packaging”, SemiTHERM 2008, San Jose, CA, 2008.

  36. Arijit Banerjee, Nikhil Lakhkar, Shahi Riaz, Dereje Agonafer and Gamal Refai-Ahmed, “Multi-Objective parametization of graphite heat spreaders for portable systems applications”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  37. Kaisare, A.; Agonafer, D.; Haji-Sheikh, A.; Chrysler, G. INTEL; Mahajan, R. INTEL, “Analytical Approach To Temperature Distribution Of A First Level Package With A Non-Uniformly Powered Die,” International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  38. Nagaraj V., Karajgikar S., Agonafer D. and Pekin S., “Bump Electromigration and Back End Design Rules”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  39. Mulay V., Karajgikar S., Agonafer D., Iyengar M. and Schmidt R., “Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  40. Uthaman R., Agonafer D., “Static Power Consumption – Silicon On Insulator Metal Oxide Semiconductor Field Effect Transistor”, International Mechanical Engineering Congress and Exposition, November11-15, 2007.

  41. Trivedi, A.; Tadepalli, C.; Kaisare, A.; Agonafer D.; Refai-Ahmed, G. AMD, “Effect of weight of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array package,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  42. Kaisare, A.; Agonafer, D.; Haji-sheikh, A.; Chrysler, G. INTEL; Mahajan, R. INTEL, “Numerical model for design of non uniform powered microprocessors using multi-objective optimization based on both thermal and device clock performance ,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  43. Mulay, V.; Karajgikar, S.; Iyengar, M.IBM; Agonafer, D.; Schmidt, R.IBM,“ Computational study of hybrid cooling solution for thermal management of data centers, ” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  44. Lakhkar, N.; Fasoro, A.; Patil, A.; Lee, W.H.; Popa, D.; Stephanou, H.; Agonafer, D., “Process development and die shear testing in MOEMS packaging,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  45. Trivedi, A.; Lakhkar, N.; Agonafer, D.; Iyengar, M. IBM; Ellsworth, M Jr. IBM; Schmidt, R. IBM ,“Experimental and Computational Characterization of a Heat sink Tester,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  46. Lakhkar, N.; Hossain, M.; Puligandla V.; Agonafer, D., “Mechanical characterization of lead SAC lead free solder with gold addition under tensile loading,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  47. Fasoro, A.; Pandojirao, P.; Lee, W.H.; Popa, D.; Stephanou, H.; Agonafer, D., “die and wafer-level hermetic for MEMS applications,” 2007 ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’07, July 8-12, 2007.

  48. Paruchuri, Srikar, Sin, Jeongsik, Graff, Mason and Agonafer, D., “Flexible PDMS Chip with Embedded In-plane Valves for Microfluidic Manipulations,” 5th International Conference on Nanochannels, Microchannels and Minichannels, June 18-20, 2007, Puebla, Mexico.

  49. Hossain, M.M., Sudhakar Jagarkal, Dereje Agonafer, Menberu Lulu, and Stefan Reh, “Design Optimization and Reliability of PWB Level Electronic Package”, Journal of Electronic Packaging, March 2007,Volume 129, Issue 1, pp. 9-18 .

  50. Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, and Bahgat Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” Journal of Electronic Packaging, Transactions of the ASME, v 128, Issue 4, December 2006, pp. 380-387

  51. Kaisare, Abhijit, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, and Ravi Mahajan, “Approximate Analytical Model for a First Level Package with Non-Uniformly Powered Die,” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  52. Hossain, Mohammad, Dereje Agonafer, Viswanadham Puligandla, and Tommi Reinikainen, “Deformation Characteristics and Constitutive Relationship of SnAgCu Lead Free Solder Alloys under Thermo-mechanical and Mechanical Loading.” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  53. Sung, Baekyoung, Chepuri Krishna Teja, Venkata, Yongje Lee, Dereje Agonafer, Damena Agonafer, and Cristina Amon, “Thermal Enhancement of Stacked Dies Using Thermal Vias.” International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  54. Bhopte, Siddharth, Madhusudan K. Iyengar, Bahgat Sammakia, Roger Schmidt and Dereje Agonafer, “Numerical Modeling of Data Center Clusters – Impact of Model Complexity”, International Mechanical Engineering Congress and Exposition 2006, November 5-10, Chicago Hilton.

  55. Bhopte, Siddharth, Madhusudan Iyengar, Bahgat Sammakia, Roger Schmidt and Dereje Agonafer, “Effect of Under Floor Parameters on Data Center Performance”, Honorary Symposium for Dr. Suhas V. Patankar, International Mechanical Engineering Congress and Exposition 2006, November 5-10, 2006, Chicago Hilton.

  56. Kaisare, A., Dereje Agonafer, A. Haji-Sheikh, Ravi Mahajan and Greg Chrysler, “Analytical approach to temperature distribution of a first level package with a non-uniformly powered processor”, ITHERM May 30-June 2, 2006, Sheraton San Diego Hotel and Marina.

  57. Bhopte, Siddharth, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt and Dereje Agonafer, “Effect of Under-Floor Blockages on Data Center Performance”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  58. Sandur, Bhavani P.D., Abhijit Kaisare, Dereje Agonafer, University of Texas-Arlington, USA, Damena Agonafer, Cristina Amon, Carnegie Mellon University; and Terry Dishongh, Intel Corporation, “Thermal Management of Stacked Die that Includes Memory and Logic Processors”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  59. Hossain, Mohammad M. Fahad Zahedi, Dereje Agonafer, Viswam Puligandla, Tommi Reinikainen, Steven Dunford, “Reliability of lead free SAC solder interconnects under mechanical loading with different PWB surface finishes”, ITHERM May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA

  60. Hossain, M.M., Y.C. Lee, Roksana Akhter, Dereje Agonafer, Senol Pekin, and Terry Dishongh, “Solder Joint Fatigue Life Predictions varying the Die Stacking Architectures for Flash Memory Applications”, ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA

  61. Abiodun A. Fasoro, Dan O. Popa, Heather Beardsley, Jeongsik Sin, Dereje Agonafer, Harry E. Stephanou and Michael A. Deeds, “Fluxless Optical Fiber Attachment for Hermetic MOEMS Applications,” ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  62. Bedekar, Vishwas, Saket Karajgikar, Dereje Agonafer, Madhusudan Iyengar and Roger Schmidt, “Effect of Crac Location on Fixed Rack Layout,” ITHERM, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  63. Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, Dereje Agonafer and Harry Stephanou, “Design of Polymer Tube Embedded In-Plane Micropump,” May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  64. Borovic, Bruno, Frank L. Lewis, Hossain, M.M., and Dereje Agonafer, “Robust Multiphysics FEA Methodology for Extracting a Reduced-Order Model of MEMS Thermal Actuators”, published in ECTC, May 30-June 2, 2006, Sheraton San Diego Hotel and Marina, San Diego, CA.

  65. Hossain, M.M., Y. Lee, Roksana Akhter, Dereje Agonafer, Senol Pekin, and Terry Dishongh, “Reliability of Stack Packaging Varying the Die Stacking Architectures for Flash Memory Applications”, SemiTHERM, March 12-16, 2006, Dallas, TX.

  66. Kaisare, Abhijit, Dereje Agonafer, A Haji-Shiekh, Ravi Mahajan and Greg Chrysler, “Design Rule For Minimizing Thermal Resistance In A Non–uniformly Powered Microprocessor”, SemiTHERM, March 12-16, 2006, Dallas TX.

  67. Borovic, Bruno, Frank L. Lewis, Dereje Agonafer, Edward S. Kolesar, Mohammad M. Hossain, Dan O. Popa, “Method for Determining a Dynamical State Space Model for Control of Thermal MEMS Devices,” Journal of Microelectromechanical Systems, Vol. 14, Issue 5, October 2005, p 961-970.

  68. Lakhkar, Nikhil R., Madhusudan Iyengar, Michael Ellsworth Jr., and Dereje Agonafer, “Design of a cold plate tester for accurate measurement of thermal performance,” Proceedings of International Mechanical Engineering Congress and Exposition-05 Orlando FL, November 5-11, 2005.

  69. Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, Dereje Agonafer and Harry Stephanou. “Polymer tube embedded in-plane micropump: design, analysis and fabrication.” Proceedings of International Mechanical Engineering Congress and Exposition-05 Orlando FL, November 5-11, 2005.

  70. Akhter, Roksana, Bhavani P.D. Sandur, Mohammad Hossain, Abhijit Kaisare, Dereje Agonafer, Kent Lawrence and Terry Dishongh, “Design for Stackability of Flash Memory Devices Based on Thermal Optimization”, Proceedings of 24th Digital Avionics Systems Conference, Washington, D.C., October 30 – November 3, 2005

  71. Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, and Dereje Agonafer, “Polymer Tube Embedded In-Plane Micropump for Low Flow Rate”, Kole, Ashutosh, Jeongsik Sin, Woo Ho Lee, Dan Popa, and Dereje Agonafer. Proceedings of 24th Digital Avionics Systems Conference, Washington, D.C., October 30 – November 3, 2005.

  72. Refai-Ahmed, Gamal and Dereje Agonafer, “Thermal Road map for Telecom Equipment,” ASHRAE Transactions, v 111 n 1, 2005, p 913-920

  73. Bhopte, Siddharth, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,”. InterPACK’05 Conference, San Francisco, CA, July 17-22, 2005.

  74. Karajgikar, Saket, Wonkee Ahn, and Dereje Agonafer, “Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage,” InterPACK’05 Conference, San Francisco, CA, July 17-22, 2005.

  75. Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, A., Chrysler, Greg, and Mahajan, Ravi, “Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK’05, San Francisco, CA, July 17-22, 2005.

  76. Hossain, Mohammad, Agonafer, Dereje, Puligandla, Viswanadham, and Reinikainen, Tommi, “Lead-Free and Sn/Pb Solders Alloy Behavior under Cyclic Bending,” InterPACK’05, San Francisco, CA, July 17-22, 2005.

  77. Karajgikar, Saket; Lakhkar, Nikhil; Agonafer, Dereje; Schmidt, Roger, “Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: Computational and experimental”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 95-100

  78. Mulay, Veerendra; Kulkarni, Amit; Agonafer, Dereje; Schmidt, Roger, “Effect of the location and the properties of thermostatic expansion valve sensor bulb on the stability of a refrigeration system”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 85-94

  79. Amon, Cristina; Agonafer, Dereje, “Foreword: Special issue on electronic cooling”, Journal of Heat Transfer, v 127, n 1, January, 2005, p 1

  80. Bhopte, Siddharth; Alshuqairi, Musa S.; Agonafer, Dereje; Refai-Ahmed, Gamal, “Mixed convection of impinging air cooling over heat sink in telecom system application”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 519-523

  81. Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, “Methodology for an integrated (electrical/mechanical) design of PWBA”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 524-527

  82. 82 Wang, P., Huang, G., Ching, H., Hsu, H., Novotny, S., Ahn, W., and Agonafer, D., “µPGA Socket and Solder Joint Reliability Study”, 2004, Proc. of Pan Pacific Electronic Conference and SMTA, 3, Kauai, Hawaii, pp. 67–84.

  83. Makwana, Yasin; Agonafer, Dereje; Manole, Dan, “Impact of TXV and compressor in the stability of a high-end computer refrigeration system”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4, December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 554-559

  84. Sammakia, Bahgat; Agonafer, Dereje, “Journal of Electronic Packaging, Transactions of the ASME: Foreword”, Journal of Electronic Packaging, Transactions of the ASME, v 126, n 4,December, 2004, Thermal Management of Electronic Systems: Four Decades of Progress, p 409

  85. Agonafer, Damena; Ibarra, Juan; McGee, Kendrick; Platt, Frank; Harris, Kendall; Agonafer, Dereje, “Heat pipe optimization team the heat pipe assisted heat sink project”, Innovations in Engineering Education 2004: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, Innovations in Engineering Education 2004:Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, 2004, p 363-372

  86. Kuravi, Suma; Agonafer, Dereje, “Validation of ASHRAE equation to find evaporation rates in humid cavity”, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 375, n 2, Proceedings of the ASME Heat Transfer Division - 2004, 2004, p 109-116

  87. Xu, Leon (NOKIA Inc., MS 3-4-1400); Reinikainen, Tommi; Ren, Wei; Wang, Bo Ping; Han, Zhenxue; Agonafer, Dereje, “A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending”, Microelectronics Reliability, v 44, n 12, December, 2004, p 1977-1983

  88. Hossain, Mohammad M; Agonafer, Dereje; Viswanadham, Puligandla; Reinikainen, Tommi, “Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 358-367

  89. Jagarkal, Sudhakar G.; Hossain, Mohammad Masum; Agonafer, Dereje; Lulu, Menberu; Reh, Stefan, “Design optimization and reliability of PWB level electronic package”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 368-376

  90. Borovic, Bruno; Lewis, Frank L.; Hossain, Mohammad M.; Agonafer, Dereje; Kolesar, Edward S., “Experimentally verified procedure for determining dynamical model of the ETM MEMS structures”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 541-548

  91. Halvi, Ananth Srivatsav; Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, “Simulation of PWB warpage during fabrication and due to reflow”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 674-678

  92. Karajgikar, Saket; Lakhkar, Nikhil; Agonafer, Dereje; Schmidt, Roger, “Impact of area contact between sensor bulb and evaporator return line on MRU - Part II, experimental work”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 1, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, p 232-236

  93. Haji-Sheikh, A.; Beck, J.V.; Agonafer, D., “Steady-state heat conduction in multi-layer bodies”, International Journal of Heat and Mass Transfer, v 46, n 13, June, 2003, p 2363-2379

  94. Makwana, Yasin; Agonafer, Dereje; Manole, Dan, “Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 533-538

  95. Lakhkar, Nikhil; Karajgikar, Saket; Agonafer, Dereje; Schmidt, Roger, “The impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit - Part I, Computational Study”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 651-656

  96. Novotny, Shlomo; Ahn, Wonkee; Agonafer, Dereje, “A Methodology for an Integrated (Electrical/Mechanical) Design of PWBA”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 721-727

  97. Alshuqairi, Musa S; Refai-Ahmed, Gamal; Agonafer, Dereje, “Mixed Convection of Impinging Air Cooling over Heat Sink in Telecom System Application”, American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003, p 777-783

  98. Hossain, Mohammad Masum; Agonafer, Dereje; Viswanadham, Puligandla; Reinikainen, Tommi, “The effect of intermetallic compound in solder joint fatigue life prediction using finite element modeling”, Advances in Electronic Packaging, v 1, Advances in Electronic Packaging 2003: Volume 1, 2003, p 853-862

  99. Ahn, Wonkee; Agonafer, Dereje; Novotny, Shlomo, Advances in Electronic Packaging, “The Impact of Board Layout and Layup on PWB Warpage during fabrication and due to Reflow Solder Process: A Review of Literature”, v 1, Advances in Electronic Packaging 2003: Volume 1, 2003, p 863-877

  100. Guggari, Shrishail; Agonafer, Dereje; Beady, Christian; Stahl, Lennart, “A hybrid methodology for the optimization of data center room layout”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 605-612

  101. Kulkarni, Amit; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part II”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 613-619

  102. Kulkarni, Amit; Agonafer, Dereje; Groothuis, Steven; Kabir, Humayun; Johnson, S., “Package and board level study for a thin small outline package (TSOP) using compact components”, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003: Volume 2, 2003, p 867-873.

  103. Mulay, Veerendra; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system”, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 374, n 2, Proceedings of the ASME Heat Transfer Division – 2003

  104. Nnanna, A.G. Agwu; Haji-Sheikh, A.; Agonafer, D., “Effect of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces”, Journal of Electronic Packaging, Transactions of the ASME, v 125, n 3, September, 2003, p 456-460

  105. Ellsworth Jr., M.J., Schmidt, R.R., Agonafer, D., “Design and Analysis of a Scheme to Mitigate Condensation on an Assembly used to Cool Processor Module”, IBM Journal of Research and Development, v 46, n 6, November 2002, p 753-760.

  106. Agonafer, Dereje, “Foreword”, Thermal Management of Microelectronic Equipment, 2002, p xxiii

  107. Agwu Nnanna, A.G; Haji-Sheikh, A.; Agonafer, D., “Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 292-297

  108. Kulkarni, A.; Mulay, Veerendra; Agonafer, Dereje; Schmidt, Roger, “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part I”, Thermomechanical Phenomena in Electronic Systems -Proceedings of The Intersociety Conference, 2002, p 403-407

  109. Kaisare, Abhijit; Han, Zhenxue; Agonafer, Dereje; Ramakrishna, K., “Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package”, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 926-931

  110. “Foreword”, Agonafer, Dereje, Thermal Management of Microelectronic Equipment, 2002, p xxiii

  111. “Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces”, Agwu Nnanna, A.G; Haji-Sheikh, A.; Agonafer, D., Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 292-297

  112. “Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part I”, Kulkarni, A.; Mulay, Veerendra; Agonafer, Dereje; Schmidt, Roger, Thermomechanical Phenomena in Electronic Systems -Proceedings of The Intersociety Conference, 2002, p 403-407

  113. “Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package”, Kaisare, Abhijit; Han, Zhen-Xue; Agonafer, Dereje; Ramakrishna, K., Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, p 926-931

  114. “Message from the: Electronics and Photonics Packaging Division Chair”, Agonafer, Dereje, Advances in Electronic Packaging, v 1, 2001, p ii

  115. “Message from the Electronics and Photonics Packaging Division Chair”, Agonafer, Dereje, Advances in Electronic Packaging, v 2, 2001, p ii

  116. “Message from the Electronics and Photonics Packaging Division Chair”, Agonafer, Dereje, Advances in Electronic Packaging, v 3, 2001, p ii

  117. “Numerical prediction of the thermal resistance of cold plate”, Agonafer, Dereje; Han, Zhen-Xue; Schmidt, Roger, Advances in Electronic Packaging, v 2, Advances in Electronic Packaging; Thermal Management Reliability, 2001, p 983-987

  118. “Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study”, Agwu Nnanna, A.G.; Agonafer, Dereje; North, Mark T., Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1763-1768

  119. “Numerical studies on chimney-enhanced natural convection”, Han, Zhen-Xue; Agonafer, Dereje, Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1769-1774

  120. “Numerical simulations of the natural convective heat transfer inside an electronic device”, Han, Zhen-Xue; Agonafer, Dereje, Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1775-1780

  121. “A three dimensional thermo-mechanical analysis of a BGA package”, Kaisare, Abhijit D; Agonafer, Dereje; Lam, Patrick, Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, 2001, p 1781-1785