ME 5352. FUNDAMENTALS
IN ELECTRONIC PACKAGING (3-0)
An introductory treatment of electronic packaging, from single chip to multichip, including materials, electrical design, thermal design, mechanical design, package modeling and simulation, processing considerations, reliability, and testing.
Prerequisite: Heat Transfer, Material Science and Fluid Dynamics.
ME 5353. APPLICATION OF
COMPUTATIONAL TECHNIQUES TO ELECTRONIC PACKAGING (3-0)
This course will develop the student's capability to characterize the heat performance of electronic cooling devices by using Commercial Computational Heat Transfer Codes like IDEAS ESC, Icepack, FLOTHERM, CFDAce. In addition, the use of Macroflow, a network based model, for system-level thermal design for electronics cooling will be presented. A number of industry-related problems ranging from first-level packages through system-level packages would be analyzed. At the end of the class, a student is expected to formulate and model complex industry-based problems using the commercial CFD codes. There will be frequent industry speakers on specific projects being studied in the class.
ME 5354. FAILURES AND THEIR PREVENTION IN ELECTRONIC PACKAGES (3-0)
A comprehensive overview of the fundamental causes for failures in electronic assemblies which include the printed wiring board, package, and second-level assemblies. Failure detection techniques and methodologies, key failure analysis techniques used will be discussed.
ME 5355. MECHANICAL
FAILURE OF ELECTRONIC PACKAGES (3-0)
Failure analysis, fatigue of electronic packages, fracture and creep behavior of solders. Mechanical properties of substrate materials. Electromigration and failure mechanisms.
ME 5356.CHIP SCALEPACKAGING (3-0)
Overview of area array packaging with special emphasis on the maturing chip scale packaging technology. Topics covered will include the design concepts of this technology, the materials related aspects, the manufacturing processes, and their reliability in a variety of applications.