Alumni

Name: Despande, Abhishek

Thesis Title: Birth-to-death Modeling Methodology for the Optimization of Custom Board-Level Reliability, Semiconductor Research Corporation/Texas Instruments, GRC Task 2512.001

Year: 2014 || Degree: M.S.

Name: Khan. Hassaan Ahmad

Thesis Title: “Experimental and Simulation Board Level Reliability Assessment of Wafer Level Chip Scale Packages (WCSPs) Under Thermal Cycling”

Year: 2014 || Degree: M.S.

Name: Raghunathan, R.

Thesis Title: “Experimental Study On The Effect
Of Gaseous Contamination On IT
Equipment”

Year: 2013 || Degree: M.S.

Name: Rajagopalan, K.

Thesis Title: “Comparative Analysis of Widely Used Air Containment System in Commercial Datacentre for Maximum Cooling Preformance”

Year: 2013 || Degree: M.S.

Name: Joshi, P.

Non-Thesis Project Title: “Thermal Enhancement of Automobile ECM ”

Year: 2013 || Degree: M.Engg.

Name: Sampath, S..

Thesis Title: “Thermal Analysis of High End Servers Based on Development of Detail Model and Experinment”

Year: 2013 || Degree: M.S.

Name: Shah, J.

Thesis Title: “Utilization of Microencapulated Phase Change Material For the Optimization of Evaporative Cooling Technology”

Year: 2013 || Degree: M.S.

Name: Shah, H.

Thesis Title: “Gaseous Corrosion in Hard Disk Drive: A Computational Study”

Year: 2013 || Degree: M.S.

Name: Patel, H.

Thesis Title: “Immersion Cooling of High End Data Centre Server and Validation Through Experinment”

Year: 2013 || Degree: M.S.

Name: Hirachan, A.

Thesis Title: “Mitigation of Hot-Spots in High-End Microprocessor Using Bulk and Thin Film Thermoelectric Coolers”

Year: 2013 || Degree: M.S.

Name: Dhiman, N.

Thesis Title: “Application of Phase Change Material in Sustainable Cooling of Data Centres”

Year: 2013 || Degree: M.S.

Name: Raman, T.

Thesis Title: “Assessment of The Mechanical Integrity of CU/LOW-K Dielectric In A Flip Chip Package”

Year: 2012 || Degree: M.S.

Name: Pandiyan, V.

Thesis Title: “Development of Detailed Computation Flow Model of High End Server”

Year: 2012 || Degree: M.S.

Name: Aurangbadkar, K.

Thesis Title: “Impact of Louver Orientation n Air Flow Distribution d Thermal Management of Data Centre”

Year: 2012 || Degree: M.S.

Name: Shah, N.

Thesis Title: “CFD Analysis of Direct Evaporative Cooling Zone of Air-Side Economizer for Containerized Data Centre”

Year: 2013 || Degree: M.S.

Name: Patel, V.

Thesis Title: “Experimental Computational Analysis of Active Cooling of Stacked Device Using Multidimensional Configured Thermoelectic Module”

Year: 2013 || Degree: M.S.

Name: Kannan, Naveen.

Thesis Title: “Design and Modelling Techniques for Telecommunication System”

Year: 2011 || Degree: M.S.

Name: Lingamplli, S.

Thesis Title: “Performance Optimization of Multicore Processors Using Core Hopping Thermo-Mechanical”

Year: 2011 || Degree: M.S.

Name: Kunal, K.

Non-Thesis Project Title: “Study of Effect of Contamination in Data Centre”

Year: 2011 || Degree: M.Engr.

Name: Gulawani, Govind

Non-Thesis Project Title: “CFD Analysis of Heat Sinks of Data Centre Servers”

Year: 2011 || Degree: M.Engr.

Name: Phan, Jake.

Dissertation: “Development of an Experinmental and Analytical Model of an Active Cooling Method for High Powered Three Dimensional Integrated Circuit (3D-IC) Utilizing a Multidimensional Configured Thermoelectric Modules”

Year: 2011 || Degree: PhD

Name: Murlidharan, B.

Thesis Title: “Multi Objective Thermal nd Energy Based Design Optimization of Telecommunication Cabinets/Shelters”

Year: 2010 || Degree: M.S.

Name: Mynampati, V.

Thesis Title: “Alternative Cooling Technologies for Telecommunication Data Centres: Air Cooling and Rear Door Heat Exchangers”

Year: 2010 || Degree: M.S.

Name: Kumar, V

Non-Thesis Project Title: “Optimization of a Micro-Channel Heat Sink for Minimum Pumping Power in High Power Device”

Year: 2010 || Degree: M.Engr.

Name: Huynh,T.

Non-Thesis Project Title: “Terahertz(THz) Quantum Cascade Laser Device-Level Thermal Performance Assessment & Some Aspects of Realibility”

Year: 2010 || Degree: M.Engr.

Name: Karajgikar, S.

Dissertation: “Effective Thermal Management of Electronic Devices From System to Die Level”

Year: 2010 || Degree: PhD

Name: Lakhkar, N

Dissertation: “Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Acclerated Thermal Cyclic Reliablility”

Year: 2010 || Degree: PhD

Name: Iqbal Mariam, F.

Thesis Title: “Thermal Management of Outside Plant Telecommunication Cabinets: Design and CFD Modeling Methodolgy”

Year: 2010 || Degree: M.S.

Name: Menon, A.

Thesis Title: “Thermo-Mechanical Analysis of 3D Package in Microelectronics and Cooling Technologies for an IGBT Thermal Tester in Power Electronics”

Year: 2010 || Degree: M.S.

Name: Raghu, A.

Thesis Title: “Dynamic Thermal Management of MultiCore Processors Using Core Hopping”

Year: 2010 || Degree: M.S.

Name: Assadi, S.

Non-Thesis Title: “”

Year: 2010 || Degree: M.Engr

Name: Mulay, V.

Dissertation: “Development of Guidelines for Dynamics Thermal Management of Data Centres by Monitoring and Control of Cooling Equipement Based on Rack Inlet Temperature”

Year: 2009 || Degree: Phd

Name: Banerjee, A.

Thesis Title: “Multi-Objective Optimization of Graphic Heat Spreader For Portable System Application”

Year: 2009 || Degree: M.S.

Name: Lingam, R.

Non-Thesis Project Title: “Chassis Design and Thermal Analysis of Motor Controllers in a Quadruped Robot”

Year: 2009 || Degree: M.Engr

Name: Brady, H.

Non-Thesis Project Title: “”

Year: 2009 || Degree: M.Engr

Name: Tanwar, R.

 

Year: 2009 || Degree:

Name: Raju, U.

Thesis Title: “Characterization of Thermal Challenges in Electronics: Leakage Current, Co-Architectural Design and Rack Level Cooling”

Year: 2009 || Degree: M.Engr

Name: Gandhi, R.

Thesis Title: “Review of Thermal Interface Technology”

Year: 2008 || Degree: M.S.

Name: Nagaraj, V.

Thesis Title: “Flip Chip Back End Design Parameters to Reduce Bump Electromigration”

Year: 2008 || Degree: M.S.

Name: Rodrigo, E.N.

Thesis Title: “Analytical Thermal Model of Generic MultiLayer Spacerless 3D Package”

Year: 2008 || Degree: M.S.

Name: Trivedi, A.

Thesis Title: “ThermoMechanical Solutions in Electronic Packaging: Component to System Levelt”

Year: 2008 || Degree: M.S.

Name: Udakeri, R.

Thesis Title: “Comparison of Overhead Supply & Under Floor Supply With Rear Door Heat Exchange in High Density Data Center Clusters”

Year: 2008 || Degree: M.S.

Name: Yasin, K.

Thesis Title: “Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application”

Year: 2008 || Degree: M.S.

Name: Fasoro, A.

Dissertation: “Design for Reliability in Microoptelectromechanical Systems (MOEMS)”

Year: 2008 || Degree: PhD

Name: Kaisare, A.

Dissertation: “An Analytical and Numerical Model For Design of NonUniformly Powered Silicon Chips Based on Both Thermal and Device Clock Performance”

Year: 2007 || Degree: PhD

Name: Paruchuri, Srikar

Thesis Title: “Flexible Microfluidic Circuit With Embedded in Plane Valve”

Year: 2007 || Degree: M.S.

Name: Cherapuri Krishna Teja, V

Thesis Title: “Thermal Enhancement of Stacked Dice Replacing G Wire Bonds with Through Silicon Vias at Location of Die Pads”

Year: 2007 || Degree: M.S.

Name: Dewan Sandur, B.

Thesis Title: “Thermal Management of Die Stacking Architectures Memory and Logic Processor”

Year: 2006 || Degree: M.S.

Name: Tadepalli, C.

Non-Thesis Project Title: “Effect of Weight of Heat Sink on Mechanical Reliabilty of a Wire Bonded Plastic Ball Grid Array Package”

Year: 2006 || Degree: M.Engr

Name: Patil, A.

Thesis Title: “MEMS Packaging: Fluxless Soldering and Reliability Assessment”

Year: 2006 || Degree: M.S.

Name: Bedekar, V

Thesis Title: “Effect of CRAC Location On A Fixed Rack Layout of a Data Center”

Year: 2006 || Degree: M.S.

Name: Joseph, S.A.

Non-Thesis Project Title: “Design methodology of development of Heat Sink for Highend CPUs”

Year: 2006 || Degree: M.Engr

Name: Manne, K.

Thesis Title: “Design and Optimization of Heat Spreaders and Selection of Fan in Laptop”

Year: 2006 || Degree: M.S.

Name: Nikalaje, S.

Non-Thesis Project Title: “Generating G code’s / NC Program using CATIA V5 for Student”

Year: 2006 || Degree: M.Engr

Name: Sung, Baek

Thesis Title: “Thermal Enhancement of Stacked Dies Using Thermal Vias”

Year: 2006 || Degree: M.S.

Name: Hossain, M.

Dissertation: “Development of Constiutive Equation and Methodology for Failure Prediction Models for SAC Lead-free Alloys”

Year: 2006 || Degree: PhD

Name: Henderson, C.

Non-Thesis Project Title: “Solder Joint Fatigue Analysis Using the Disturbed State Concept”

Year: 2006 || Degree: M.Engr

Name: Lee, Y.J.

Non-Thesis Project Title: “Thermal Reliability of 3D Stack Packaging in Finite Element Method”

Year: 2006 || Degree: M.Engr

Name: Bhat, M.

Non-Thesis Project Title: “Implementation of Effective Lean Methodology in the Design and Fabrication of Microprocessor Chip”

Year: 2006 || Degree: M.Engr

Name: Mahur, S.

Non-Thesis Project Title: “Effect of Surface Roughness in Simulating PWB Packages”

Year: 2006 || Degree: M.Engr

Name: Zahedi, F.

Non-Thesis Project Title: ““Reliability of LeadFree Solder Under Cyclic Bending”

Year: 2006 || Degree: M.Engr

Name: Lakhakar, N.

Thesis Title: “Development of High Performance Cold Plate Tester”

Year: 2005 || Degree: M.S.

Name: Kole, A.

Thesis Title: ““Polymer Tube Embedded inPlane Micropump: Design, Analysis and Fabrication”

Year: 2005 || Degree: M.S.

Name: Bhopte, S.

Thesis Title: “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature”

Year: 2005 || Degree: M.S.

Name: Sethuraman, S.

Non-Thesis Project Title: “Optimization of a Finned Heat Sink for Microprocessor Cooling”

Year: 2005 || Degree: M.Engr

Name: Shah, B.

Non-Thesis Project Title: “”

Year: 2005 || Degree: M.Engr

Name: Bhat, M.

Non-Thesis Project Title: “Implementation of Lean Methodology in the Design and Manufacturing of Microprocessors”

Year: 2005 || Degree: M.Engr

Name: Challa, Y.

Non-Thesis Project Title: “Single Wafer Encapsulation of MEMS Device”

Year: 2005 || Degree: M.Engr

Name: Prasad, Y.

Non-Thesis ProjectTitle: “Simulation Methodologies for the Solder Joint Crack Growth and Fatigue Life Prediction”

Year: 2005 || Degree: M.Engr

Name: Jupudi, A.

Non-Thesis Project Title: “Heat Analysis of Data Centre”

Year: 2004 || Degree: M.Engr

Name: Roberts, D.

Non-Thesis Project Title: “3DCooling Case Study: Tessera, Inc’s PyxisTM Platform”

Year: 2004 || Degree: M.Engr

Name: Devireddy, S.

Non-Thesis Project Title: “Role of Electronic Package in Cell phones and Future Directions of Cell Phones”

Year: 2004 || Degree: M.Engr

Name: Shah, A.

Non-Thesis Project Title: “Heat Pipe Assisted Heat Sink Optimization of Spacing Between Heat Pipes-A CFD Study”

Year: 2004 || Degree: M.Engr

Name: Halvi, A.

Thesis Title: “Simulation of PWB Warpage During Fabrication and due to reflow”

Year: 2004 || Degree: M.S.

Name: Akhter, R.

Thesis Title: “Optimal Thermal Management of Stacked Die Package: Design for Stackability”

Year: 2004 || Degree: M.S.

Name: Karajgikar, S.

Thesis Title: “Effect of Area Contact on the Stability of Modular Refrigeration Unit and Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage”

Year: 2004 || Degree: M.S.

Name: Kuravi, S.

Thesis Title: “Estimation of Evaporation Rates in Humid Cavities”

Year: 2004 || Degree: M.S.

Name: Riaz, S.

Thesis Title: “Microchannel Liquid Cooling System for High Heat Flux Integrated Circuit”

Year: 2004 || Degree: M.S.

Name: Ahn, W.

Dissertation: “Development of a Design Tool to Assist Layout/Layup Design to Minimize Warpage of a PWB During Fabrication and Reflow Solder Processes”

Year: 2004 || Degree: PhD

Name: Puppala, O.

Non-Thesis Project Title: “Thermal Analysis of Flip Chip BGA Package”

Year: 2003 || Degree: M.Engr

Name: Kulkarni, A.

Thesis Title: “A Thermal Simulation of a Thin Small Outline Package, Using Compact Components, and a Study of Effect of Change in TXV Bulb Location on the Stability of a Refrigeration System”

Year: 2003 || Degree: M.S.

Name: AlShuqairi, M.

Thesis Title: “Mixed Convection of Impinging Air Cooling Over a Parallel Plate Heat Sink”

Year: 2013 || Degree: M.S.

Name: Veluswamy, R.

Thesis Title: “Thermal Design and Modeling of an Improved Circuit Spot Cooler”

Year: 2003 || Degree: M.S.

Name: Guggari, S.

Thesis Title: “A Hybrid Methodology for Optimization of the Data Center Room Layout”

Year: 2003 || Degree: M.S.

Name: Jagarkal, S.

Thesis Title: “Optimization and Reliability of Electronic Packages”

Year: 2003 || Degree: M.S.

Name: Mulay, V.

Thesis Title: “An Experimental Study of Effects of Thermophysical Properties of Thermostatic Expansion Valve Sensor Bulb on Stability of Refrigeration System”

Year: 2003 || Degree: M.S.

Name: Makwana, Y.

Thesis Title: “Stability, Efficiency and Control System of a Masterflux Compressor in a Refrigeration Unit of a High End Computer”

Year: 2003 || Degree: M.S.

Name: Ramaswamy, K.

Non-Thesis Project Title: “Facility and Equipment Thermal Guidelines for Data Center and Other Data Processing Environments”

Year: 2003 || Degree: M.Engr

Name: Rodney, R.

Non-Thesis Project Title: “An Investigation of Friction Factors for Printed Circuit Card Assemblies”

Year: 2002 || Degree: M.Engr

Name: Bondili, V.

Non-Thesis Project Title: “Computational Characterization of Impingement Flow in Parallel Plate Heat Sinks”

Year: 2002 || Degree: M.Engr

Name: Mustafa, W.

Non-Thesis Title: “Fracture Mechanics Analysis of Kovar Leads”

Year: 2002 || Degree: M.Engr

Name: Oprea,F.

Non-Thesis ProjectTitle: “Thermoelectric Breakdown of CMOS Devices”

Year: 2001 || Degree: M.Engr

Name: Kaisare, A.

Thesis Title: “A 3Dimensional Thermo-Mechanical
Analysis of a Ball Grid Array Package”

Year: 2002 || Degree: M.S.

 

 

   

     

  

 

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